Silicon ChipKickStart - October 2021 SILICON CHIP
  1. Outer Front Cover
  2. Contents
  3. Subscriptions: PE Subscription
  4. Subscriptions: PicoLog Cloud
  5. Back Issues: PICOLOG
  6. Publisher's Letter
  7. Feature: The Fox Report by Barry Fox
  8. Feature: Techno Talk by Mark Nelson
  9. Feature: Net Work by Alan Winstanley
  10. Project: Mini WiFi LCD BackPack by Tim Blythman
  11. Project: USB Supercodec by Phil Prosser
  12. Project: Ultrasonic High Power Cleaner by John Clarke
  13. Project: Colour Maximite 2 (Generation 2) by Phil Boyce , Geoff Graham and Peter Mather
  14. Feature: AUDIO OUT by Jake Rothman
  15. Feature: Max’s Cool Beans by Max the Magnificent
  16. Feature: Circuit Surgery by Ian Bell
  17. Feature: IoT Cricket by Khairul Alam
  18. Feature: KickStart by Mike Tooley
  19. Advertising Index
  20. PCB Order Form

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Articles in this series:
  • (November 2020)
  • Techno Talk (December 2020)
  • Techno Talk (January 2021)
  • Techno Talk (February 2021)
  • Techno Talk (March 2021)
  • Techno Talk (April 2021)
  • Techno Talk (May 2021)
  • Techno Talk (June 2021)
  • Techno Talk (July 2021)
  • Techno Talk (August 2021)
  • Techno Talk (September 2021)
  • Techno Talk (October 2021)
  • Techno Talk (November 2021)
  • Techno Talk (December 2021)
  • Communing with nature (January 2022)
  • Should we be worried? (February 2022)
  • How resilient is your lifeline? (March 2022)
  • Go eco, get ethical! (April 2022)
  • From nano to bio (May 2022)
  • Positivity follows the gloom (June 2022)
  • Mixed menu (July 2022)
  • Time for a total rethink? (August 2022)
  • What’s in a name? (September 2022)
  • Forget leaves on the line! (October 2022)
  • Giant Boost for Batteries (December 2022)
  • Raudive Voices Revisited (January 2023)
  • A thousand words (February 2023)
  • It’s handover time (March 2023)
  • AI, Robots, Horticulture and Agriculture (April 2023)
  • Prophecy can be perplexing (May 2023)
  • Technology comes in different shapes and sizes (June 2023)
  • AI and robots – what could possibly go wrong? (July 2023)
  • How long until we’re all out of work? (August 2023)
  • We both have truths, are mine the same as yours? (September 2023)
  • Holy Spheres, Batman! (October 2023)
  • Where’s my pneumatic car? (November 2023)
  • Good grief! (December 2023)
  • Cheeky chiplets (January 2024)
  • Cheeky chiplets (February 2024)
  • The Wibbly-Wobbly World of Quantum (March 2024)
  • Techno Talk - Wait! What? Really? (April 2024)
  • Techno Talk - One step closer to a dystopian abyss? (May 2024)
  • Techno Talk - Program that! (June 2024)
  • Techno Talk (July 2024)
  • Techno Talk - That makes so much sense! (August 2024)
  • Techno Talk - I don’t want to be a Norbert... (September 2024)
  • Techno Talk - Sticking the landing (October 2024)
  • Techno Talk (November 2024)
  • Techno Talk (December 2024)
  • Techno Talk (January 2025)
  • Techno Talk (February 2025)
  • Techno Talk (March 2025)
  • Techno Talk (April 2025)
  • Techno Talk (May 2025)
  • Techno Talk (June 2025)
KickStart b y M ike Tooley Part 5: Getting to grips with EMC Our occasional KickStart series aims to show readers how to use readily available low-cost components and devices to solve a wide range of common problems in the shortest possible time. Each of the examples and projects can be completed in no more than a couple of hours using T hose of you that are as old as me will doubtless recall the seemingly endless ‘smog’ that we had to live with in the 1950s. ‘Smoke fog’ was an unpleasant consequence of the UK’s increasing post-war reliance on coal as a fuel, leading eventually to the introduction of the United Kingdom Clean Air Act in 1956. Less visible, but still undesirable, is the ‘electronic smog’ that surrounds the growing number of electronic devices that we rely on in our everyday lives. And, while you might be blissfully unaware of ‘electronic smog’, it can still have a serious impact on the environment in which it is placed. Consequently, electromagnetic compatibility (EMC) has become an important consideration in the design and use of any item of electronic or electrical equipment – but, before delving deeper into this important and often misunderstood subject, it’s perhaps worth exploring what we mean by ‘electromagnetic compatibility’ and how it relates to the two associated terms ‘electromagnetic interference’ (EMI) and ‘electromagnetic susceptibility’ (EMS). Put simply, EMS is a measure of how a device reacts to the electromagnetic environment in which it is used, while EMI is an indicator of how much a device impacts its electromagnetic environment. Thus, EMI and EMS are both important when considering an equipment’s compatibility with the environment in which it is used. Why is all this significant? Simply this, when designing, constructing and using electronic equipment we need to consider how the equipment will interact with the electromagnetic environment in which it is placed. Furthermore, failure to observe EMC precautions 64 ‘off-the-shelf’ parts. As well as briefly explaining the underlying principles and technology used, the series will provide you with a variety of representative solutions and examples, along with just enough information to be able to adapt and extend them for your own use. This fifth KickStart instalment explains the importance of electromagnetic compatibility (EMC) with some practical hints on how to reduce electromagnetic interference (EMI) and electromagnetic susceptibility (EMS) in your PCBs, circuits and projects. can have serious consequences. In the commercial world and in most, but not all countries, emissions that cause potential interference to other apparatus and services are strictly regulated. It is also worth noting that EMC regulations normally specify limits on acceptable levels of interference, and often specify tests to be carried out to verify compliance. any item of electronic equipment. Emissions may be radiated in the form of electromagnetic (radio) waves, or they may be conducted from the equipment along power lines and other wiring. In most countries, limits on the magnitude of these emissions are imposed by regulatory bodies. These limits are designed to protect all users of the radio spectrum from the effects of harmful or annoying interference which may degrade the performance of other nearby electronic equipment. Common EMI sources include: Sources of EMI Electromagnetic emissions can (and do) arise from various sources within Fig.5.1. Spectral analysis of the MW band in the author’s workshop. Fig.5.2. Spectral analysis repeated in the vicinity of an EMI-producing SMPS. Practical Electronics | October | 2021 Fig.5.3. Waveform of the output of the EMI-producing SMPS.  Active (radiating) antennas and their associated feeders when poorly matched or inadequately screened  Fundamental and harmonic components of repetitive waveforms such as clock signals or switching waveforms used in an SMPS (switched-mode power supply)  Unwanted ‘parasitic’ oscillation resulting from poor circuit design and/or layout  Transients caused by short-duration pulses  Radiation of wideband noise from magnetic components. To put this into a practical context, Fig.5.1 shows the normal frequency spectrum and waterfall display of radio signals in the medium wave (MW) band in the author’s workshop. The spectrum display shows signal amplitude over the range extending from 500kHz to 1.8MHz, while the waterfall shows how signal amplitude varies with time. Individual broadcast MW signals can be clearly seen, and the noise floor is at around –100dB. Compare this spectrum with that shown in Fig.5.2 when a lowcost 5V switched-mode power supply (SMPS) is operated in the vicinity of the spectrum analyser’s antenna. Note how the noise floor has risen by about 18dB with broadband spurious harmonic components masking all but the strongest broadcast signals. The waveform at the output of the EMI-producing 5V SMPS is shown in Fig.5.3. This reveals a switching transient with an amplitude of 100mV and a repetition frequency of around 20kHz (the power supply’s switching frequency). Additional filtering and screening are urgently needed to improve performance and comply with the relevant EMC regulations! A quick check procedure Accurate methods of investigating EMI involve the use of specialist test equipment (spectrum analysers, test Practical Electronics | October | 2021 Fig.5.4. Effective grounding to a metal enclosure can be important to comply with EMC regulations. fixtures and calibrated antennas) that is usually only available in test labs (see Going further at the end). Despite this, a quick check on the level of EMI produced by a suspect item of electronic equipment (such as an SMPS) can be carried out using nothing more than a portable MW AM radio receiver. Placing the receiver close to the equipment under investigation and sweeping it across the MW band (around 1MHz) will usually reveal some radiated noise. Then, moving it away from the equipment following the connecting cables and supply leads should reveal the presence of any conducted noise. Using this technique, it is possible to obtain a quick assessment of the performance of EMI improvement methods, such as screening, grounding and filtering. Improving EMC performance There are various ways of improving EMC performance to reduce the amount of EMI produced by a ‘noisy’ item of electronic equipment. Measures can also be taken to prevent the ingress of noise to reduce susceptibility to EMI experienced by nearby equipment. 1. Shielding and grounding EMC performance is significantly improved by effective shielding (screening) and grounding (earthing). Not only can this help to reduce radiation from noise-producing circuitry, but it will also help reduce the ingress of noise experienced by equipment that might be suffering the effects of EMI. An effective low impedance path to ground is an essential pre-requisite. This helps bypass noise currents to ground (zero potential) thereby reducing the noise potential that might exist between a component’s 0V pin and the supply ground. To eliminate unwanted ground loops a single common ground point is often used for internal wiring (see Fig.5.4). This helps to avoid the situation in which small noise voltages enter the signal path between multiple ground points. Screening is important to prevent unwanted signals from being radiated from equipment. Screening should be a continuous grounded metal surface. This is often aluminium, steel or tinplate of an appropriate gauge which must be grounded at several points. It’s important to ensure that adequate ventilation is included in the screening design – equipment that produces heat should not be totally enclosed for obvious reasons! Wire mesh and/ or small ventilation holes are usually permissible unless the frequencies concerned are high, in which case primary internal as well as secondary outer screening is needed. 2. PCB considerations The PCB design can be crucial in optimising EMC performance, and it is essential that the design process takes this into consideration. Stages in an EMC-compliant design process might involve the following:  Physical parameters such as size, shape and the number and function of PCB layers  Selection and placement of individual components and off-board connectors  Track layout and routing (including power supply rails)  Grounding of common 0V tracks and decoupling of power rails  Shielding of signal leads and interconnecting wiring. Critical areas of the circuit need to be identified to ensure that that circuitry is kept within functional groups. For example, a pre-amplifier should be positioned well away from a power supply, a sensitive detector away from a switching converter, and so on. Similarly, components that are likely to carry appreciable currents need to be positioned close to the rails or grounds that connect them. PCB tracks should be kept as wide as possible to minimise 65 Fig.5.5. An example of EMC design considerations for good EMC performance. voltage drops and dedicated copper ‘land’ used to extend the ground area around HF (high-frequency) and RF (radiofrequency) circuits – see Fig.5.5. EMC-compliant PCB design techniques are gained with experience, but in the meantime it’s well worth examining any boards that you have to hand in order to gain an insight into professional layout techniques. Sensitive analogue circuitry should always be kept apart from digital circuitry (where rapidly changing logic levels of several volts may be present). Not only should analogue and digital circuitry be physically separate, but also, they should be electrically separate and the key to this is the use of entirely separate supplies with separate decoupling and ground points. Crosstalk can occur between adjacent signal lines or PCB tracks. The amount of crosstalk depends on the shared reactance – capacitive or inductive – between the two signal paths. Capacitively induced crosstalk occurs when mutual capacitance links two signal paths whereas inductively induced crosstalk occurs when adjacent signal paths are linked by mutual inductance (a similar effect to a pair of coupled windings on a transformer). Note that, in many cases, both effects may be present at the same time. The effects of crosstalk can be minimised by reducing the coupling (capacitive or inductive) between the conductors. Transmission lines and bus lines should always be matched or terminated with their specified characteristic impedance. Fig.5.6. Typical single-stage and two-stage supply filters. Fig.5.7. Circuit of the single-stage filter shown in Fig.5.6. 66 Practical Electronics | October | 2021 Fig.5.8. Circuit of the two-stage supply filter shown in Fig.5.6. This helps to reduce the presence of standing waves and ‘ringing’. A substantial ground or ‘land’ area may also be required for VHF and UHF PCB applications. ‘Guard’ areas where high-impedance signal tracks and pins are surrounded by grounded copper track may also be required to minimise capacitive coupling and protect highimpedance points. 3. Supply filters Supply filters are usually fitted at or close to power connectors and in some cases, filters can also be present within I/O connectors (Ethernet connectors often incorporate common-mode filters). Fig.5.6 shows two commercial pi-section supply filters. The smaller filter comprises a single inductor with two Class-X and two Class-Y capacitors, as shown in Fig.5.7. The larger filter has two cascaded stages with two inductors, three Class-X and two Class-Y capacitors. This filter also incorporates a 1MΩ discharge resistor, R1 (not present in the smaller single-stage filter). Note that, in both cases the two inductor windings are wound in opposite directions and Fig.5.9. An EMI filter fitted in an IEC mains connector. so they tend to cancel the commonmode currents. The two filters shown in Fig.5.7 combine two different network topologies. The Class-X capacitors are designed to filter differential-mode currents, while the common-mode inductor and Class-Y capacitors are designed to filter common-mode noise. The resistor shown is usually 100kΩ to 200kΩ and its purpose is to provide a discharge path for any residual line voltage stored on the capacitors. Measurements carried out by the author reveal that the single-stage filter has a rejection of greater than 30dB at 1MHz while the two-stage filter provides a rejection in excess of 60dB at the same frequency. Fig.5.9 shows an EMI filter fitted inside an IEC mains Fig.5.10. A simple home-constructed pisection filter offering a rejection of 40dB at 1MHz. Fig.5.13. Test circuit used to obtain the characteristic shown in Fig.5.12. Fig.5.11. Circuit of the home-constructed filter shown in Fig.5.10. Fig.5.12. Frequency response of the home-constructed filter shown in Fig.5.10. Practical Electronics | October | 2021 Fig.5.14. Ferrite core filters suitable for clamping onto cables. 67 Table 5.1: Going Further with EMC Topic Source EMC regulations and directives Notes The UK Electromagnetic Compatibility Regulations 2016 can be found at: https://bit.ly/pe-oct21-ks1 The EU Electromagnetic Compatibility (EMC) Directive can be found at: https://bit.ly/pe-oct21-ks2 The Slovenian Institute of Quality and Metrology (SIQ) provides a short introduction to EMC at: https://youtu.be/8SbegmFJ_WM YouTube videos Power Electronics Basics provides a detailed discussion of EMC and EMI at: https://youtu.be/C2UDpUAgoSQ The short SIQ video also provides a glimpse into a modern EMC testing laboratory. By contrast, Andy Lawson’s comprehensive lecture lasts nearly an hour. Andy Lawson’s Beginner’s Guide to EMC can be found at: https:// youtu.be/n4tB2UqZN6c Part 8 of Electronics Teach-in 4 (available from PE magazine) provides a general introduction to analogue circuit applications including passive and active filters. Filters The Laird Technology website has a useful guide to ferrite EMI cable cores: https://bit.ly/pe-oct21-ks3 Ferrite cores The Coilcraft website provides a useful introduction to inductors and chokes at: https://bit.ly/pe-oct2-ks4 A similar guide is available from TDK at: https://bit.ly/pe-oct21-ks5 Your best bet since MAPLIN Chock-a-Block with Stock Visit: www.cricklewoodelectronics.com Or phone our friendly knowledgeable staff on 020 8452 0161 Components • Audio • Video • Connectors • Cables Arduino • Test Equipment etc, etc The Coilcraft website (see below) provides some useful information in the form of application notes on the design of L-C filters. The Laird guide a useful “rule of thumb” guide to selecting ferrite cores for use in EMI suppression. The TDK guide shows test equipment set-up used for measuring the performance of ferrite clamp-on filters. A wide range of clamp-on ferrite cores is available from Mouser Electronics: www.mouser.co.uk connector. Note that the filter is completely enclosed in an aluminium case which must be properly earthed to ensure satisfactory performance (see earlier). A simple home-constructed pi-section filter for a lowvoltage DC supply (up to 50V at 2A) is shown in Fig.5.10. The circuit of this filter is shown in Fig.5.11 and its measured frequency response is shown in Fig.5.12. The rejection at 1MHz was measured at 40dB. Fig.5.13 shows the simple test circuit used. Finally, radiation from cables can be significantly reduced by fitting clamp-on ferrite cores (see Fig.5.14). Clamp-on ferrite cores consist of two semi-circular cores that can be quickly and easily snapped onto cable in a single operation and without the need to cut the cable or remove any existing connectors. They are available in various grades and dimensions and are usually more effective when mounted close to the incoming supply connectors of EMI-producing equipment. When selecting a clamp-on core for a particular application it is advisable to check manufacturers’ data sheet specifications for their recommended frequency range and attenuation characteristic. It is also worth noting that the effectiveness of most cores increases with frequency (up to a maximum for the core in question) and attenuation can be significantly improved by winding several turns through the core. For example, a popular Fair-Rite clamp-on ferrite core exhibits an impedance of 200Ω at 50MHz with only a single pass-through conductor but this increases to 800Ω and 1.9kΩ with two and three turns respectively. Going further Visit our Shop, Call or Buy online at: www.cricklewoodelectronics.com 020 8452 0161 68 Visit our shop at: 40-42 Cricklewood Broadway London NW2 3ET This section (shown above) details a variety of sources that will help you locate the component parts and further information that will allow you to understand EMC and improve the EMI and EMS performance of your electronic designs and equipment. It also provides links to relevant regulations and underpinning knowledge. Practical Electronics | October | 2021