Silicon ChipPIC AND AVR Breakout Boards - October 2023 SILICON CHIP
  1. Outer Front Cover
  2. Contents
  3. Subscriptions: PE Subscription
  4. Subscriptions
  5. Back Issues: Hare & Forbes Machineryhouse
  6. Publisher's Letter: Time for some new PICs
  7. Feature: Holy Spheres, Batman! by Max the Magnificent
  8. Feature: Net Work by Alan Winstanley
  9. Project: Automatic Level Crossing and Semaphore Control by LES KERR
  10. Project: Multi-Stage Buck-Boost Battery Charger by Tim Blythman
  11. Project: PIC & AVR Chips from Microchip by Tim Blythman
  12. Project: PIC AND AVR Breakout Boards by Tim Blythman
  13. Feature: Arduino Bootcamp – Part 10 by Max’s Cool Beans
  14. Feature: AUDIO OUT by Jake Rothman
  15. Feature: KickStart by Mike Tooley
  16. Feature: Circuit Surgery by Ian Bell
  17. PCB Order Form
  18. Advertising Index by Ian Batty

This is only a preview of the October 2023 issue of Practical Electronics.

You can view 0 of the 72 pages in the full issue.

Articles in this series:
  • (November 2020)
  • Techno Talk (December 2020)
  • Techno Talk (January 2021)
  • Techno Talk (February 2021)
  • Techno Talk (March 2021)
  • Techno Talk (April 2021)
  • Techno Talk (May 2021)
  • Techno Talk (June 2021)
  • Techno Talk (July 2021)
  • Techno Talk (August 2021)
  • Techno Talk (September 2021)
  • Techno Talk (October 2021)
  • Techno Talk (November 2021)
  • Techno Talk (December 2021)
  • Communing with nature (January 2022)
  • Should we be worried? (February 2022)
  • How resilient is your lifeline? (March 2022)
  • Go eco, get ethical! (April 2022)
  • From nano to bio (May 2022)
  • Positivity follows the gloom (June 2022)
  • Mixed menu (July 2022)
  • Time for a total rethink? (August 2022)
  • What’s in a name? (September 2022)
  • Forget leaves on the line! (October 2022)
  • Giant Boost for Batteries (December 2022)
  • Raudive Voices Revisited (January 2023)
  • A thousand words (February 2023)
  • It’s handover time (March 2023)
  • AI, Robots, Horticulture and Agriculture (April 2023)
  • Prophecy can be perplexing (May 2023)
  • Technology comes in different shapes and sizes (June 2023)
  • AI and robots – what could possibly go wrong? (July 2023)
  • How long until we’re all out of work? (August 2023)
  • We both have truths, are mine the same as yours? (September 2023)
  • Holy Spheres, Batman! (October 2023)
  • Where’s my pneumatic car? (November 2023)
  • Good grief! (December 2023)
  • Cheeky chiplets (January 2024)
  • Cheeky chiplets (February 2024)
  • The Wibbly-Wobbly World of Quantum (March 2024)
  • Techno Talk - Wait! What? Really? (April 2024)
  • Techno Talk - One step closer to a dystopian abyss? (May 2024)
  • Techno Talk - Program that! (June 2024)
  • Techno Talk (July 2024)
  • Techno Talk - That makes so much sense! (August 2024)
  • Techno Talk - I don’t want to be a Norbert... (September 2024)
  • Techno Talk - Sticking the landing (October 2024)
  • Techno Talk (November 2024)
  • Techno Talk (December 2024)
  • Techno Talk (January 2025)
  • Techno Talk (February 2025)
  • Techno Talk (March 2025)
  • Techno Talk (April 2025)
  • Techno Talk (May 2025)
  • Techno Talk (June 2025)
Items relevant to "Stewart of Reading":
  • Bookshelf Speaker Passive Crossover PCB [01101201] (AUD $10.00)
  • Bookshelf Speaker Subwoofer Active Crossover PCB [01101202] (AUD $7.50)
  • Bookshelf Speaker Passive and Active Crossover PCB patterns (PDF download) [01101201-2] (Free)
  • Bookshelf Speaker System timber and metal cutting diagrams (PDF download) (Panel Artwork, Free)
Articles in this series:
  • Easy-to-build Bookshelf Speaker System (January 2020)
  • Building the new “bookshelf” stereo speakers, Pt 2 (February 2020)
  • Building Subwoofers for our new “Bookshelf” Speakers (March 2020)
  • Stewart of Reading (October 2023)
  • Stewart of Reading (November 2023)
  • ETI BUNDLE (December 2023)
  • Active Subwoofer For Hi-Fi at Home (January 2024)
  • Active Subwoofer For Hi-Fi at Home (February 2024)
PIC and AVR Breakout Boards By Tim Blythman T he three Breakout Boards we designed are intended to plug into a breadboard while also connecting to a Snap or PICkit 4 programmer for power and programming. Two can be used with the four PIC parts we discussed in the feature article: one for SOIC parts and the other for DIP. The circuit for these two boards is identical – see Fig.3. The other is designed for the AVR64DD32 and its circuit is shown in Fig.6. The PICkit 4 cannot provide power in UPDI mode (as for newer AVR chips), so we recommend using a Snap modified to provide 5V with the AVR64DD32. PIC Breakout These PIC Breakout Boards accept SOIC (Fig.4) or DIP (Fig.5) devices up to 20 pins. They are designed to provide basic programmer connections as well as the two passive components needed for a minimal working setup. They break out each pin of the microcontroller to an adjacent header pin. This could be a standard header below to plug into a breadboard, or a header socket above, into which you can plug jumper wires. We’ll describe the parts needed to plug into a breadboard. Many recent 8-bit PIC parts have standard pinouts on their topmost pins, shown as pins 1-4 and 17-20 in Fig.1. So this Breakout should work for most recent 8-pin, 14-pin and 20-pin 8-bit PICs, as long as they are placed at the top of the Breakout. You could fit the DIP breakout with a 20-pin narrow IC socket to allow parts to be changed in and out. Alternatively, a narrow ZIF (zero insertion force) socket could be used, turning the Breakout Board into a handy programming jig. Assembly of the PIC Breakout During construction, refer to the appropriate overlay diagram, Fig.4 or Fig.5. Both are double-sided boards, with the SOIC version being 15.5 × 32.5mm and the DIP version being 15 × 35.5mm. If you have the SMD version, start by soldering the microcontroller in place. If it is a 20-pin part, it will be a tight fit, so keep it clear of the pads for the header pins. Apply flux and rest the chip in place, ensuring that pin 1 goes to the end near CON1. 8-pin and 14-pin parts won’t be as fussy as they are narrower but should have their pin 1 in the same location. Tack one lead and check that all the remaining pins are aligned before soldering the others. Check there are no bridges between pins or to the header pin pads; if there are, clean them up with flux, solder braid and a clean iron. Then use an appropriate solvent to remove any remaining flux. Fig.3: the 20-pin Breakout Board circuit connects the programmer header (CON1) to the chip with all pins also going to a pair of SIL headers. 20-pin PIC Breakout Board 40 Figs.4 and 5: the breakout boards have been designed for breadboarding or general use (eg, plugging into a pair of SIL sockets). They accept 8, 14 and 20-pin devices with pin 1 in the same position. Practical Electronics | October | 2023 If you have the DIP version, solder the socket or IC in place. Like the SMD part, you can tack one lead and then check that the socket or IC is flat and flush before soldering the other leads. Next, solder the capacitor and resistor and trim their leads close to the PCB. To fit and align the header pins, it’s a good idea to plug them into a breadboard first. This will guarantee that the pins will align with the breadboard in the future. Place the PCB over the pins and push it down flat. Tack the corner pins and adjust if necessary before soldering the remaining pins. Finally, fit the right-angled header, CON1. Then connect your programmer, being sure to align the arrows that mark pin 1 on both the programmer and the Breakout’s programming header. AVR Breakout The PCB overlay for the 16 × 53.5mm AVR Breakout Board is coded 24110223 and is available from the PE PCB Service – it is shown in Fig.7. We’ve made it as narrow as possible to conserve breadboard space, resulting in a gap in the middle of the rows of pins. It therefore has 16 pins down each side, but they take up 20 rows on a breadboard. Since there are two main power rails and the VDDIO2 pin for the MVIO feature, there are three bypass capacitors. The jumper shunt connects the two rails, which is necessary for applications that don’t use MVIO. The 1kW resistor on this board is connected between VDD and UPDI. This is discussed in the accompanying Parts List – PIC Breakout Board 1 double-sided PCB coded 24110225, 15.5 × 32.5mm (for SOIC parts) OR 1 double-sided PCB coded 24110222 15 × 35.5mm (for DIP parts) 1 8/14/20 pin PIC16F18xxx microcontroller in SOIC/DIP package 1 20-pin DIL IC socket (optional; for DIP micros) 2 10-way pin headers, 2.54mm pitch 1 5-way right-angle pin header, 2.54mm pitch (CON1) 1 100nF MKT or ceramic capacitor All PCBs available from 1 10kW axial 1/4W resistor the PE PCB Service Parts List – AVR64DD32 Breakout board 1 double-sided PCB coded 24110223, 16 × 53.5mm 4 8-pin headers, 2.54mm pitch 1 4-way right-angle male header, 2.54mm pitch (CON1) 1 2-way header and jumper shunt, 2.54mm pitch (JP1) 3 100nF MKT or ceramic capacitors 1 1kW axial 1/4W resistor 1 AVR64DD32-I/PT 8-bit microcontroller, TQFP-32 (7×7mm) (IC1) article and it is necessary if you are using a Snap programmer. Assembling the AVR Breakout The pitch of the TQFP AVR64DD32 chips is finer than SOIC parts, but still not too difficult to solder. Apply flux and rest the part roughly in place, ensuring pin 1 is in the correct location, then tack one lead. Take care to check that all four sides are aligned before tacking another pin on an opposite corner, then soldering all the remaining leads. Remember that you can use flux, solder wicking braid and a clean iron to remove any bridges. Fit the three capacitors next and follow with the 1kW resistor if that is needed. JP1 can be installed next. You should leave the jumper shunt in place unless you plan to connect an alternative VDDIO2 supply and activate MVIO. Like the DIP PIC Breakout, you can align the header pins by pushing them into a breadboard first. Leave a gap of four rows in the middle, then push the PCB down firmly before soldering the pins. Finally, fit the four-way header (CON1) for the programmer and attach the programmer. The arrow marks pin 1 and the programmer should have a corresponding mark. MPLAB X If you haven’t used the MPLAB X IDE before, see our PIC n’ Mix feature (PE, July and September 2020; January, March, May, July 2021). If you need to manually install the DFP (device family pack) for the AVR64DD32 or any of the PIC parts, use the Tools → Packs menu item. Reproduced by arrangement with SILICON CHIP magazine 2023. www.siliconchip.com.au Fig.6: The AVR64DD32 Breakout Board is similar but brings the pins out to four headers as the chip has pins on four sides. AVR64DD32 Breakout Board Practical Electronics | October | 2023 Fig.7: the four headers are arranged in two rows so they can be plugged into a breadboard. The gaps mean the board is narrow enough for a standard breadboard. 41